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| Slicing |
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 Hi-speed
Wire Saw is used for slicing hard and fragile materials, such
as Sapphire, quartz, ceramics, etc. It can higher the yield
and lower the wastage.
Max.
Diameter of Ingo |
Max.
Length of Ingot |
Width
of Cut |
Min.
Thickness of Wafer |
TTV
& BOW |
¦µ100mm |
120mm |
0.20mm-0.25mm |
0.40mm |
¡Ü80¦Ìm |
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